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Encapsulation

Secure protection for sensitive components

To ensure that electronic parts and components perform reliably, you need efficient protection. Encapsulation technology has hereby proven to be the optimum solution, partially or completely covering microchips, hybrid circuits and power semiconductor modules. For the encapsulation of ultrasensitive components such as bonded ICs, exceptionally soft silicone gels are used. These ensure the full functionality of the devices even under extreme temperature fluctuations or severe vibrations. We offer you a broad spectrum of specialized RTV-2 silicones ideally suited to your particular applications.

Advantages:

  • High compatibility with other materials
  • Economical production of large-scale, fully-automated processing using single or multiple-component metering and mixing equipment
  • Cost-efficient production of small series that are processed manually
  • Exceptional set of properties:

- Low-viscosity or shear-thinning

- Variable pot lives and vulcanization times

- Soft to hard

- Transparent to opaque

- High flame resistance and thermal conductivity

- Good thermal shock resistance

- Minimal shrinkage

- Good adhesion on plastic housings

- Minimal outgasing and bleeding of uncrosslinked components

- Exceptional damping property

- Electrically insulating

Applications:

  • Automotive electronics
  • Encapsulation of power modules
  • Sensor technology
  • Encapsulation of plugs
  • Encapsulation of inductors
  • Instrumentation and control technology
  • Light and optoelectronics
  • Lighting technology
  • Encapsulation of generators

Products:

WACKER

As a wholly owned subsidiary of Wacker Chemie AG, DRAWIN supplies the right silicone product at the right time, to the right place and in the right configuration.

Contact

+49 89 60 869-0

Certificates

SGS AEO